Study on Ultrasonic Assisted Laser under Liquid Processing Platform

Abstract:

On the basis of laser-ultrasonic machining and water assisted laser combined machining methods a composite processing method of ultrasonic assisted laser under liquid is proposed. As the key of new technology, its experimental device of combined processing is designed. The device mainly consists of laser processing machine, ultrasonic vibration system (ultrasonic generator and transducer), tank and the water circulation system, fixture of specimen. By Using of finite element method nature frequency of tank with two fixtures of specimen is solved under the condition of combined processing. Analysis results show that the main device parts would work reliably under the vibration of transducer. Physical experiment under liquid proved this platform in water could transmit ultrasonic vibration to specimen and the new combined processing is promising.

• Periodical: Advanced Materials Research (Volumes 765-767)
• Pages: 3090-3093
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.765-767.3090
• Online since: September 2013
• Authors: Yan Sheng Yao, Gen Fu Yuan, Xue Hui Chen, Ying Feng Zhu
• Keywords: Experimental Device, Finite Element, Nature Frequency, Ultrasonic Assisted Laser Machining, Vibration Platform

References

[1] Mori Masaki，Kumehara Hiroyuki，Study on Ultrasonic Laser Machining， Annals of the CIRP, 1976, 25(1): 115-119.

[2] Lau W.S., Yue T.M., Wang, M., Ultrasonic-Aided Laser Drilling of Aluminum-Based Metal Matrix composites, CIRP Annals - Manufacturing Technology, 1994, 43(1): 177-180.

DOI: 10.1016/s0007-8506(07)62190-8

[3] Yue T.M. , Chan, T.W. , Man, H.C.,  Lau, W.S.,  Analysis of Ultrasonic-Aided Laser Drilling Using Finite Element Method, CIRP Annals - Manufacturing Technology, 1996, 45(1): 169-172.

DOI: 10.1016/s0007-8506(07)63040-6

[4] Zheng H.Y., Huang H., Ultrasonic Vibration-Assisted Femtosecond Laser Machining of Microholes, Journal of Micromechanics and Microengineering, 2007, 17(8): N58-N61.

DOI: 10.1088/0960-1317/17/8/n03

[5] Chiu Chi-Cheng, Chang Chih-Hao, Lee Yung-Chun, Ultrasound Assisted Laser Machining and Surface Cleaning, 2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010, pp.872-875.

DOI: 10.1109/nems.2010.5592155

[6] Kruusing A., Underwater and Water-assisted Laser Processing: Part2-Etching, Cutting and Rarely Used Methods, Optics and Lasers in Engineering, 2004, 41: 329-352.

DOI: 10.1016/s0143-8166(02)00143-4

[7] Bernold Richerzhagen, Martin Plankensteiner, Notker U. Kling, etc. Saw + LMJ: A Hybrid Semiconductor Dicing Solution, Proc. of SPIE 2008, 6880 (5).

DOI: 10.1117/12.760357

[8] YUAN Genfu, YAO Yansheng, ZHU Shaofeng, LIANG Huaqi, The Development of Laser-Chemical Combined Large Scale Etching on Difficult-to-Cut Materials, Proceedings of the 3rd Pacific International Conference on Application of Lasers and Optics, PICALO2008, Beijing, April 16-18.

DOI: 10.2351/1.5057080