Preparation of Thin Cu Electrode on Al2O3 + Clay Substrate by Pulsed DC Magnetron Sputtering

Nuansiri Chansimuang; Tosawat Seetawan

doi:10.4028/www.scientific.net/AMR.770.335

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 770Preparation of Thin Cu Electrode on Al2O3 + Clay...

Preparation of Thin Cu Electrode on Al₂O₃ + Clay Substrate by Pulsed DC Magnetron Sputtering

Abstract:

Aluminum oxide (Al₂O₃) and Copper (Cu) are popular into insulator and electrode for thermoelectric module. The Al₂O₃ + clay substrate was prepared by solid state reaction and the thin Cu electrode prepared by pulsed DC magnetron sputtering. Crystal structure and microstructure of the substrate were measured by using the X-ray diffraction and scanning electron microscopy techniques. The Vicker hardness and density were measured by Micro Hardness tester and Archimedes method, respectively. The X-ray diffraction patterns of the substrate were obtained mix phases such as Al₂O₃, clay and Cu phases. The hardness and density were obtained mean value of 332.11 HV and 2.47 g/cm³.

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Periodical:

Advanced Materials Research (Volume 770)

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335-338

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.770.335

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Online since:

September 2013

Authors:

Nuansiri Chansimuang, Tosawat Seetawan

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Al₂O₃ + Clay + Cu Electrode Substrate, Pulsed DC Magnetron Sputtering, Thermoelectric Substrate

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