Development of a Measuring Equipment for Silicon Wafer Warp

Hai Jun Liu; Ren Ke Kang; Shang Gao; Ping Zhou; Yu Tong; Dong Ming Guo

doi:10.4028/www.scientific.net/AMR.797.561

Paper Titles

Heat Pipe Grinding Wheel in Grinding Titanium Alloy Ti-6Al-4V
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A Thin Silicon Wafer Thickness Measurement System by Optical Reflectmetry Scheme Using Fourier Transform Near-Infrared Spectrometer
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Review on Multi-Point Method for Roundness Error Separation
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Development of a Measuring Equipment for Silicon Wafer Warp
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Research on Iso-Scallop Method for NC Grinding of the Special Rotating Workpiece
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Adaptability Comprehensive Evaluation of Auto Assembly Machine Product Platform for Small Shaft and Sleeve Subassemblies
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 797Development of a Measuring Equipment for Silicon...

Development of a Measuring Equipment for Silicon Wafer Warp

Abstract:

Larger diameter wafers are used to decrease the cost of IC manufacturing and the wafer thickness is decreasing for form factor and thermal power dissipation considerations. The larger wafer requires a large scanning area to inspect the warp, and warp measurement of large and thin silicon wafers is greatly affected by the gravity-induced deflection. In this paper the gravity-induced deflection was calculated using finite element method by supporting the wafer horizontally with three steel balls. A laser displacement sensor based on triangulation principle was used to measure the warp and an air bearing stage was developed to achieve high straightness. The shape of the wafer was obtained using the silicon wafer warp measuring equipment.

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Periodical:

Advanced Materials Research (Volume 797)

Pages:

561-565

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.797.561

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Online since:

September 2013

Authors:

Hai Jun Liu, Ren Ke Kang, Shang Gao, Ping Zhou, Yu Tong, Dong Ming Guo

Keywords:

Air Bearing Stage, Finite Element Method (FEM), Gravity-Induced Deflection, Large Silicon Wafer, Thin Silicon Wafer, Warp Measuring Equipment

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