Effect of Current Density on Microstructure of Mn-Cu Thin Films via Electroplating Coating Technique

Abstract:

In the present study 304 stainless steel (SS) was electrochemical plated with nanocrystallineMn-Cu alloy coatings from a bath containing ammonium sulfate.The electrochemical investigation of Mn-Cu electrodeposited films was managed by potentiodynamic scans and galvanostatic experiments. The effect of current density on the microstructure, crystallographic structure, and chemical composition of the deposits were characterized by means of scanning electron microscopy (SEM), X-ray diffraction (XRD), and energy dispersive x-ray spectrometry (EDS), respectively.The results showed that Mn-Cu coatings obtained at low current density contain a large amount of Cu and heterogeneous microstructure, while at high current density uniform, compact, and amorphous coatings with a small amount of Cu was obtained. The results indicated that Cu co-deposition delayed the phase transformation of as-deposited ductile γ-Mn to the brittle and hard α-Mn. However, the results did not show any specific changes in grain size of the coatings with variation of current densities.

• Periodical: Advanced Materials Research (Volume 829)
• Pages: 451-455
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.829.451
• Online since: November 2013
• Authors: Maryam Haeri far, Morteza Zandrahimi*
• Keywords: Current Density, Electroplated Coating, Microstructure, Mn-Cu Alloy

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