Investigation of Intermetallic Phase Formation and Structural Analysis in Annealed Al/Cu Bilayer Thin Films

Zulhelmi Alif Abdul Halim; Muhammad Azizi Mat Yajid; Zulkifli Mohd Rosli; Riyaz Ahmad Mohamad Ali

doi:10.4028/www.scientific.net/AMR.845.221

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 845Investigation of Intermetallic Phase Formation and...

Investigation of Intermetallic Phase Formation and Structural Analysis in Annealed Al/Cu Bilayer Thin Films

Abstract:

The growth of intermetallic phases in Al/Cu bilayers thin film having 2/3 layer thickness ratios were characterized by X-ray powder diffraction (XRD), energy dispersive X-ray (EDX) and transmission electron microscopy (TEM). In annealing temperature of 200 °C, the growth is controlled by Cu diffusion which resulted to formation of θ-Al₂Cu, η-AlCu, ζ-Al₃Cu₄ and γ-Al₄Cu₉ phase.

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Periodical:

Advanced Materials Research (Volume 845)

Pages:

221-225

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.845.221

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Online since:

December 2013

Authors:

Zulhelmi Alif Abdul Halim*, Muhammad Azizi Mat Yajid, Zulkifli Mohd Rosli, Riyaz Ahmad Mohamad Ali

Keywords:

Al/Cu System, Characterization, Intermetallic, Thin Film

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