The Effects of Solution Baths to the Microstructure and Thickness of Ni-Ti Plating by High Speed Plating

Abstract:

It is difficult to obtain good adhesive property on the titanium surface. Thus, to plate metal on the titanium, oxide layer must be eliminated by using an intermediate pre-treatment. However, this process involves several steps and even then the level of addition between the plated metal and the titanium is poor. This paper presents the results of the thickness and morphology of nickel plating to titanium sample with the effects of the types of solutions. The morphology and thickness of nickel plated was studied using scanning electron microscopy (SEM) and field emission scanning electron microscopy (FESEM). The results show nickel sulphamate solution gave highest rate of plating compared to the other solutions while all chloride solution produces much fine grain structure. By using high speed electroplating and by maintaining a narrow gap between the anode and the cathode, it has been possible to electrodeposit Ni directly on Ti without any pre-treatment or even any conventional cleaning process before plating.

• Periodical: Advanced Materials Research (Volume 845)
• Pages: 251-255
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.845.251
• Online since: December 2013
• Authors: N. Zaimah, M.S. Hussain
• Keywords: Different Ni Electrolytes, Electroplating, Nanocrystalline, SEM

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