Defect Imaging via Chirp Signal Excitation in Plate

Hong Lei Chen; Fei Deng; Xi Zhang

doi:10.4028/www.scientific.net/AMR.846-847.826

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 846-847Defect Imaging via Chirp Signal Excitation in...

Defect Imaging via Chirp Signal Excitation in Plate

Abstract:

The chirp signal can bring some useful information for structural non-destructive evaluation (NDE) applications due to its broad frequency components with different sensitivity to defects that exist in test pieces. This paper introduces a defect imaging method based on the chirp signal. When a chirp signal is used as excitation in the guided wave detection system, tone burst results can be gotten from the response easily. Numerical simulation results show that this method simplifies the procedure to find the best exciting frequency and guided wave mode for the hole defect detection, and yields more accurate defect imaging results with arc imaging algorithm.

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Periodical:

Advanced Materials Research (Volumes 846-847)

Pages:

826-830

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.846-847.826

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Online since:

November 2013

Authors:

Hong Lei Chen*, Fei Deng, Xi Zhang

Keywords:

Arc Imaging Algorithm, Chirp Signal, Guided Wave

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* - Corresponding Author

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