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Investigation on Soldering High Volume Fraction SiC Particle Reinforced Aluminum Metal Matrix Composites

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Abstract:

In order to improve the poor wettability of SiCp/Al composites, surface modification by copper brush plating and an active Al-base solder containing Cu, Mg and Sn were investigated in this paper. After vacuum brazing, a good soldered joint with high shearing strength of 145.6MPa was succesfully frabricated at 580°C, holding time of 30min. The microstructure of soldered joints was studied by SEM and EDS. The results show that the Cu-plating , as a bridge, could obviously enhance the reaction between the molten solder and composites, the fractography revealed the fracture occurs within the composite, indicating a good adhesion between the solder alloy and the SiCp/Al composites.

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Periodical:

Advanced Materials Research (Volume 853)

Pages:

90-95

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.853.90

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Online since:

December 2013

Authors:

Peng Wang*, Qiang Li, Ji Tai Niu

Keywords:

Copper Brush Plating, High Shearing Strength, SiCp/Al Composites, Vacuum Brazing

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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