[1]
T. Hwang, C. Hong, C. Kim: Compos part B-Eng Vol. 34 (2003), p.481.
Google Scholar
[2]
M. Gentz, B. Benedikt, J.K. Sutter,M. K : Compos Sci Technol Vol. 64(10-11) (2004, ), p.1671.
Google Scholar
[3]
A.S. William, G. M. Donald, N.S. Tom, G.I. Peter, T.H. Raphael: Compos Sci Technol Vol. 65(2005), p (2014).
Google Scholar
[4]
L.G. Zhao, N.A. Warrior, A.C. Long: Int J Solids Struct Vol. 43 (2006), p.5449.
Google Scholar
[5]
E. Drukker, I. Kresel, A.K. Green, G. Marom: J Compos Mater Vol. 23 (2005), p.2143.
Google Scholar
[6]
D. Djokic, A. Johnston, A. Rogers, P. Lee-Sullivan, N. Mrad: Compos Part A-Appl Vol. 33(2002), p.277.
Google Scholar
[7]
S. Lee, G.S. Springer: J Compos Mater Vol. 24 (1990), p.1270.
Google Scholar
[8]
M.A. Seif, U.A. Khashaba, R. Rojas-oviedo: Compos Struct Vol. 79 (2007), p.261.
Google Scholar
[9]
J.M. Svanberg, J.A. Holmberg: Compos Part A-Appl. Vol 35 (2004), p.711.
Google Scholar
[10]
L.K. Jain, Y.W. Mai: J Compos Mater. Vol 31 (1997), p.672.
Google Scholar
[11]
X. Niu. Process induced residual stresses and dimensional distortions in advanced laminated composites. Ph.D. dissertation, University of Florida, (1999).
Google Scholar
[12]
L.G. Zhao, N.A. Warrior, A.C. Long: Mater Sci & Eng A. Vol. 452-453 (2007), p.483.
Google Scholar
[13]
T.A. Bogetti, J.W. Gillespie, R.L. McCullouqh: Int J Mater Prod Tec Vol 9 (1994), p.170.
Google Scholar
[14]
S.S. Lee, Y.S. Sohn: Struct Eng Mech. Vol 2(4) (1994), p.383.
Google Scholar
[15]
H. Chen, Z. Yang, A.K. Jemah, F.W. Williams: Compos Struct Vol 41 (1998), p.49.
Google Scholar
[16]
T. Bogetti, J.W. Gillespie Jr.,: J Compos Mater Vol 26(5) (1992), p.626.
Google Scholar
[17]
K. Oota, M. Saka: Polym Eng Sci Vol 41(8) (2001), p.1373.
Google Scholar
[18]
C. Li, K. Potter, M.R. Wisnom, G. Stringer: Compos Sci Technol Vol 64(1), p.55.
Google Scholar
[19]
D.G. Yang, K.M.B. Jansen., Q.Y. Li, J.S. Liang. Ernst L. J, Zhang. G.Q. Warpage-based optimization of the curing profile for electronic packaging polymers. Electron packaging technology proceedings, 2003, ICEPT, 2003, Fifth interational conference. 2003, p.345.
DOI: 10.1109/eptc.2003.1298757
Google Scholar