A Kind of Environment-Friendly Titanium Chemical Mechanical Polish Development

Fu Chuan Huang; Man Rong Su; Xing Zhong Tang; Hong Jun Li; Zhao Xia Lu

doi:10.4028/www.scientific.net/AMR.875-877.1275

Paper Titles

Effects of Combination of 0.02 wt % Sr and Ti on the Characteristics of AC4B Alloys Produced by Low Pressure Die Casting
p.1255

The Exploration on Forming Processing Method by Multiple Sparks EDM
p.1260

Vacuum Inert Gas Atomisation of Cr-Mn-Ni Austenitic Steel Alloys
p.1265

Research of Joining Graphite by Use of Active Solder
p.1270

A Kind of Environment-Friendly Titanium Chemical Mechanical Polish Development
p.1275

Influence of Gravity and Mold Shape on Molding of Aluminum Foams
p.1280

On Line Monitoring of Quality of Friction Surfacing
p.1285

Kiln Process Impact of Alternative Solid Fuel Combustion in the Cement Kiln Main Burner – Mathematical Modelling and Full-Scale Experiment
p.1291

Effect of Nickel Sulphate to Hypophosphite Ratio on the Electroless Deposition of Ni-P Coatings on Aluminium
p.1300

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 875-877A Kind of Environment-Friendly Titanium Chemical...

A Kind of Environment-Friendly Titanium Chemical Mechanical Polish Development

Abstract:

In this paper, fuzzy AHP to select the appropriate environment-friendly chemical mechanical polishing additives, and the rational design of the polish formulation. Practical application shows that the polish has a good anti-wear, the wear properties and anti-rust properties, stable performance ，and meets the needs of the chemical mechanical polishing, the rate of biodegradation more than 80%.

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Periodical:

Advanced Materials Research (Volumes 875-877)

Pages:

1275-1279

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.875-877.1275

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Online since:

February 2014

Authors:

Fu Chuan Huang, Man Rong Su, Xing Zhong Tang, Hong Jun Li, Zhao Xia Lu

Keywords:

Additive, Chemical Machinery, Environmental Protection, Polish

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References

[1] Walshr J. Her20gH. H. process for prolishing semiconelctor materical: US. 2170273 [P] 1968-02-23.

Google Scholar

[2] Zhaohui Zhang, Jianbin Zou . chemical mechanical polishing in the nano-scale thin-film flow [J]. Mechanical Engineering (in chinese).

Google Scholar

[3] Rahwl J, Janos F, Huang CK, etal . chemical mechanical issues interlevel dielectric application [J] . solid state sciene (1992)，pp.41-45.

Google Scholar

[4] Mark.K. H, Shang OM. Effects of pad properities on materical remoral in chemical mechanical polishing [I]. Joural of matericals process of technology (2007), pp.187-188, 73-76.

Google Scholar

[5] Maosheng Li. water-based metalworking fluid balance relationship of some important [J]. lubrication and seal (2004). 29（2），pp.74-78 (in chinese).

Google Scholar

[6] Canhui Wang, Wanzhu Hou, Qianjin Da and so on. Environmental protection type micro emulsion grinding fluids of preparation and application [J]. Bearing. (2011), 54（5），pp.10-12 (in chinese).

Google Scholar