Study on Thermal and Mechanical Properties of Polyurethane Systems for In-Mould Decoration Ink

Jing Lin; Cheng Zheng; Shu Xuan Qian; Xian Fang Cai; Yong Shun Lan; Dong Ming Zhang; Jia Wei Zhuang

doi:10.4028/www.scientific.net/AMR.881-883.850

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 881-883Study on Thermal and Mechanical Properties of...

Study on Thermal and Mechanical Properties of Polyurethane Systems for In-Mould Decoration Ink

Abstract:

In this study, three polyurethane systems A (A450/RD181/L75), B(A450/RD181/N3390) and C(A450/RD181/2104/N3390) for in-mould decoration ink were studied. The results of thermogravimetric analysis showed that introducing rosin modified phenolic resin 2104 (RMPR) and N3390 into PU system A can improve the thermal stability, Moreover, Measurements of gel fraction and swell ratio showed that incorporation of N3390 is benificial for increasing the cross-linking density of PU systems as compared to L75 so as to increase the gel fraction and decrease the swell ratio.The tensile strength of cured PU systems increased following in the order: A

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Periodical:

Advanced Materials Research (Volumes 881-883)

Pages:

850-853

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.881-883.850

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Online since:

January 2014

Authors:

Jing Lin*, Cheng Zheng, Shu Xuan Qian, Xian Fang Cai, Yong Shun Lan, Dong Ming Zhang, Jia Wei Zhuang

Keywords:

IMD Ink, Physico-Chemical Properties, Polyurethane, Thermal Stability

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