Effect of Homogenization Annealing on Microstructure and Property of Cu-7.5Ni-5Sn Alloy

Rui Qing Liu; Sheng Li Yang; Guo Jie Huang; Qiang Qiang Zhong

doi:10.4028/www.scientific.net/AMR.887-888.374

Paper Titles

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Influence of Etchants on Phase Morphology of Casting Ni-Based Superalloy
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The Measured Change in d-Electron of Ni in Ni-7.2at%Ti Alloy Studied by Electron Energy Loss Spectroscopy
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Effect of Homogenization Annealing on Microstructure and Property of Cu-7.5Ni-5Sn Alloy
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Effect of Alloying Elements V, Cr and Ni on the Electronic Structure and Mechanical Properties of FeAl from First-Principles Calculation
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Effects of Additives on the Surface Layers of Boronized TC4 Titanium Alloys
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Characterization on the Microstructures and Optical Performances of TiO₂ Doped with Transition Metals
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Dynamic Strain - Induced Boundary Migration during Dynamic Recovery at a High Temperature Deformation with a Lower Strain Rate
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Effect of Homogenization Annealing on Microstructure and Property of Cu-7.5Ni-5Sn Alloy

Abstract:

The microstructure and properties of Cu-7.5Ni-5Sn alloy after homogenization treatment was investigated. The research results show that homogenization treatment can obviously eliminate dendritic segregation in Cu-7.5Ni-5Sn alloy. The temperature of homogenization annealing has a great influence than the effect of holding time. The ingots of Cu-7.5Ni-5Sn alloy which were homogenization treated at 780°C for 24 hours can be rolled up to 30% deformation by cold-rolling. Some tiny white matter is still remaining in dendrite boundary, but atom fraction of Ni and Sn of the dendritic segregation is decreased by 12.04% and 4.73% respectively compare with casting state. The electrical conductivity and Brinell hardness of Cu-7.5Ni-5Sn alloy homogenization treated at 800°C for 24 hours is 12.8%IACS and 132Hv, and increases 18.5% and 29.9% respectively.