J-Integral Approach to Creep-Fatigue Crack Propagation in Lead-Free Solder under Various Loading Waveforms

Abstract:

Crack propagation tests of lead-free solder were conducted at room temperature in air using center-notched plates under load-controlled conditions with three waveforms: triangular pp waveform having fast loading and unloading rates, cp-h waveform having a hold time under tension, and cc-h waveform having a hold time under tension and compression. The J integral was evaluated from load-displacement curves. For fatigue loading of pp waveform, the crack propagation rate was expressed as a power function of the fatigue J-integral range. The creep component due to the hold time greatly accelerated the crack propagation rate. The creep crack propagation rate was found to be a power function of the creep J integral range for each case of cp-h and cc-h waveforms. The creep crack propagation rate for cp-h waveform was higher than that for cc-h waveform. Displacement-controlled tests were also performed under four triangular strain waveforms: pp, cp, cc and pc. For the case of pp waveform, the crack propagation rate was also expressed as the same power function of the fatigue J integral range as in the case of load-controlled tests. The creep crack propagation rate was expressed as a power function of the creep J integral range for each case of cp, pc and cc waveforms. Microscopic observations were conducted to clarify micromechanisms of creep-fatigue crack propagation.

• Periodical: Advanced Materials Research (Volumes 891-892)
• Pages: 365-370
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.891-892.365
• Online since: March 2014
• Authors: Keisuke Tanaka*, Takashi Fujii, Kazunari Fujiyama
• Keywords: Crack Propagation, Creep-Fatigue Interaction, Hold-Time Effect, Ĵ-Integral, Lead-Free Solder, Loading Waveform

References

[1] J. Zhao, Y. Mutoh, Y. Miyashita, L. Wang, Fatigue crack growth behavior of Sn-Pb and Sn-based lead-free solders, Engng Fract Mech, 70 (2003) 2187-2197.

DOI: 10.1016/s0013-7944(02)00252-7

[2] K. Tanaka, Creep-fatigue crack propagation in lead-free solder under cyclic loading with various waveforms, Engng Fract Mech, 77 (2010) 2187-2197.

DOI: 10.1016/j.engfracmech.2010.01.010

[3] K. Tanaka, T. Hirasawa, Y. Sakagawa, K. Fujiyama, Effect of load waveform on creep-fatigue crack propagation in lead-free solder, J Soci Mater Sci Japan, 59(2010) 833-839.

DOI: 10.2472/jsms.59.833

[4] K. Tanaka, R. Sakai, T. Hirasawa, Y. Sakagawa, K. Fujiyama, Creep-fatigue crack propagation in lead-free solder under various strain waveforms, Trans Japan Soci Mech Eng, Series A, 77 (2011) 402-414.

DOI: 10.1299/kikaia.77.402

[5] S. Taira, R. Ohtani, T . Kitamura, K. Yamada, J-integral approach to crack propagation under combined creep and fatigue condition. J Soci Mater Sci Japan, 28(1979) 414-420.

[6] R. Ohtani, High temperature fatigue. In: R. O. Richie, Y. Murakami (Eds. ), Comprehensive Structural Integrity, vol. 4, Cyclic Loading and Fatigue. Elsevier; (2003) 327-344.

DOI: 10.1016/b0-08-043749-4/04090-8

[7] N. E. Dowling, Geometry effects and J integral approach to elastic-plastic fatigue crack growth. In: J. L. Swedlow, M. L. Williams (Eds. ), Cracks and Fracture, ASTM STP 601, American Society for Testing and Materials, (1976) 19-32.

DOI: 10.1520/stp28635s