High Power LED Heat Dissipation Comparison Analysis via Aluminum and Copper Slug

Abstract:

The vast development of the LED industry has created contemporary set of thermal issues with limits the reliability of the high power LEDs. Thus, this paper reports a simulation analysis done on single chip high power LED package to evalute the effects of heat slug material on the heat dissipation of the LED package. The heat dissipation of two types of heat slug material, aluminum (Al) and copper (Cu) were compared in terms of junction temperature, von Mises stress and thermal resistance of the LED chip at varied input power of 0.1 W and 1W. Results of the analysis showed that the copper heat slug exhibits a better heat dissipation due to its superior thermal conductivity.

• Periodical: Advanced Materials Research (Volume 893)
• Pages: 811-814
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.893.811
• Online since: February 2014
• Authors: Rajendaran Vairavan, Zaliman Sauli*, Vithyacharan Retnasamy
• Keywords: Aluminum Slug, ANSYS, Copper Slug, Heat Slug Material, High Power LED, Junction Temperature, Von Mises Stress

References

[1] Z. Ma, X. Zheng, W. Liu, X. Lin, and W. Deng, Fast thermal resistance measurement of high brightness LED, in Electronic Packaging Technology, 2005 6th International Conference on, 2005, pp.1-3.

DOI: 10.1109/icept.2005.1564685

[2] G. Rong-feng, T. Da-lei, W. Xing, and Z. Wen-qing, Thermal, mechanical and optical analysis of SiC-based LED, in Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th, 2008, pp.939-944.

DOI: 10.1109/eptc.2008.4763550

[3] X. Luo, R. Hu, T. Guo, X. Zhu, W. Chen, Z. Mao, and S. Liu, Low thermal resistance LED light source with vapor chamber coupled fin heat sink, in Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th, 2010, pp.1347-1352.

DOI: 10.1109/ectc.2010.5490645

[4] H. H. Cheng, D. -S. Huang, and M. -T. Lin, Heat dissipation design and analysis of high power LED array using the finite element method, Microelectronics Reliability, vol. 52, pp.905-911, (2012).

DOI: 10.1016/j.microrel.2011.05.009

[5] Y.F. Su, S.Y. Yang, T.Y. Hung, C.C. Lee, and K.N. Chiang, Light degradation test and design of thermal performance for high-power light-emitting diodes, Microelectronics Reliability, vol. 52, pp.794-803, (2012).

DOI: 10.1016/j.microrel.2011.07.059

[6] K. Zhang, D. Xiao, X. Zhang, H. Fan, Z. Gao, and M. M. Yuen, Thermal performance of LED packages for solid state lighting with novel cooling solutions, in Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on, 2011, p.1.

DOI: 10.1109/esime.2011.5765839

[7] Z. Sauli, V. Retnasamy, R. Vairavan, W. M. W. N. Haimi, H. Kamarudin, Y. Neoh Fung, and N. Khalid, Solid State Lighting Stress and Junction Temperature Evaluation on Operating Power, in Computer Modelling and Simulation (UKSim), 2013 UKSim 15th International Conference on, 2013, pp.290-293.

DOI: 10.1109/uksim.2013.127

[8] R. Vairavan, Z. Sauli, V. Retnasamy, R. C. Ismail, N. I. M. Nor, N. S. Nadzri, and H. Kamarudin, High Power LED Thermal and Stress Simulation on Copper Slug, in Computer Modelling and Simulation (UKSim), 2013 UKSim 15th International Conference on, 2013, pp.294-298.

DOI: 10.1109/uksim.2013.150

[9] M.H. Chang, D. Das, P. V. Varde, and M. Pecht, Light emitting diodes reliability review, Microelectronics Reliability, vol. 52, pp.762-782, (2012).

DOI: 10.1016/j.microrel.2011.07.063