TMAH Etching of Silicon Wafer for Detector Fabrication

Lin Qi; Min Yu; Shao Nan Wang; Hong Zhi Liu; Bao Hua Shi; An Qi Hu; Hong Du; Jin Yan Wang; Yu Feng Jin

doi:10.4028/www.scientific.net/AMR.901.15

Paper Titles

Preface and Organizing Committee

Surface Effects on the Buckling of Nanowires Based on Modified Core-Shell Model
p.3

A Comparison Study of Fire Resistance of High Strength Structural Steels According to Boundary Condition
p.11

TMAH Etching of Silicon Wafer for Detector Fabrication
p.15

Phase-Shifted Bragg Gratings Based on Hybrid Plasmonics Structure
p.21

Surface Enhanced Raman Scattering Based on Dielectric-Loaded Surface Plasmon Polariton Waveguides
p.25

A Novel System for Fine Particle Concentration Measurement
p.29

Polymerization of Acrylamide Photo Initiated by Ferroferric Oxide Nanoparticles
p.35

The Drug Loading Thermodynamics Mechanism of Eight Cationic Drugs’ Adsorption onto Ion Exchange Fiber
p.41

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 901TMAH Etching of Silicon Wafer for Detector...

TMAH Etching of Silicon Wafer for Detector Fabrication

Abstract:

Anisotropic wet etching of high resistivity silicon by TMAH for the fabrication of large area silicon radiation detectors is studied in this work. TMAH is widely applied in microelectronics and micromechanical fabrication etching low resistivity silicon, whereas the etching of high resistivity silicon was seldom studied by the industry. This work focused on the research of TMAH etching of high resistivity lager area silicon wafer aiming at its application in silicon radiation detector fabrication. We investigated the etching properties of TMAH of 4 inch (111) silicon wafers. Various parameters combinations were explored, such as TMAH solution concentration of 25wt%, 15wt% and 5wt%, and temperature of 95 °C, 90 °C and 85 °C. Etch rate, etch uniformity and silicon surface roughness were observed.

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Periodical:

Advanced Materials Research (Volume 901)

Pages:

15-20

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.901.15

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Online since:

February 2014

Authors:

Lin Qi, Min Yu*, Shao Nan Wang, Hong Zhi Liu, Bao Hua Shi, An Qi Hu, Hong Du, Jin Yan Wang, Yu Feng Jin

Keywords:

Anisotropic Etching, Silicon, TMAH

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* - Corresponding Author

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