Embedded Electronics Influence on the Strength of Carbon Fiber Laminate

Hendrik Herranen; Jaan Kers; Jürgo S. Preden; Robert Talalaev; Martin Eerme; Jüri Majak; Henri Lend; Georg Allikas

doi:10.4028/www.scientific.net/AMR.905.239

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 905Embedded Electronics Influence on the Strength of...

Embedded Electronics Influence on the Strength of Carbon Fiber Laminate

Abstract:

A complex electronics circuit placeholder is embedded in the carbon fiber laminate. The reduction of the material mechanical strength is assessed. The strain interaction between electronics and carbon fiber laminate is measured with digital image correlation based deformation scanner GOM ARAMIS 2M. A finite element analysis model is developed and validated. Based on FEA results the response model for prediction of the mechanical properties of laminate is introduced.

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Periodical:

Advanced Materials Research (Volume 905)

Pages:

239-243

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.905.239

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Online since:

April 2014

Authors:

Hendrik Herranen*, Jaan Kers, Jürgo S. Preden, Robert Talalaev, Martin Eerme, Jüri Majak, Henri Lend, Georg Allikas

Keywords:

CFRP, Composite, Embedded Electronics, FEM Analysis, Structural Health Monitoring (SHM)

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