Dielectric Properties and Microstructure of BaO-Nd2O3-Bi2O3-TiO2 Microwave Ceramics with Li2O-B2O3-SiO2

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Low temperature co-fired ceramics (LTCC) technology becomes crucial in the development of various modules and substrates in electronic packaging, especially in wireless and microwave applications [. With this technology, passive components (such as capacitors and inductors) can be embedded into substrates, and co-fired with high-conductive metals (such as silver and copper) below 900°C. Therefore, the shringkage and dielectric properties of LTCC are of great importance to the performance of components. So far, ceramic/glass composites have been widely researched for LTCC application due to tailored physical properties and low sintering temperature [2-3].

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12-17

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April 2014

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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