Improvement in the Low-Fire Dielectric Compositions with Middle Permittivity for LTCC Applications

Yong Gang Zhang; Xiao Gang Wu

doi:10.4028/www.scientific.net/AMR.906.25

Paper Titles

Synthesis of Hierarchy-Structural BaTiO₃ Powder Used for X8R Multilayer Ceramic Capacitors by Two-Step Soft Chemical Method
p.3

Effect of H₃BO₃ Coating on the Microwave Dielectric Properties of BZN Ceramics
p.8

Dielectric Properties and Microstructure of BaO-Nd₂O₃-Bi₂O₃-TiO₂ Microwave Ceramics with Li₂O-B₂O₃-SiO₂
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Effect of Process on the Dielectric Properties of BaTiO₃-Based X9R Ceramics
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Improvement in the Low-Fire Dielectric Compositions with Middle Permittivity for LTCC Applications
p.25

Low Temperature Sintering of Lead-Free BaTiO₃-Based X9R Ceramics with Bi₂O₃ Dopant and Assisted by LiF-CaF₂ Flux Agent
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High Efficient Photoreduction CO₂ with H₂O on Metal Cu-Modified Graphitic Ordered Mesoporous Carbon Supported TiO₂ Catalysts under Simulated Solar
p.39

Processing Effect on the Compressive Strength and Bioactivity of Ti-Based Composites Produced with TiH₂ and Calcium Phosphate
p.45

Rechargeable Alkali and Alkaline Earth Metal-Air Batteries – Potential and Challenges
p.51

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 906Improvement in the Low-Fire Dielectric...

Improvement in the Low-Fire Dielectric Compositions with Middle Permittivity for LTCC Applications

Abstract:

Low temperature co-fired ceramics (LTCC) technology becomes crucial in the development of various modules and substrates in electronic packaging, especially in wireless and microwave applications [. self-integrated component has laid basis on flexibility of design, wiring density and dependability for multilayer structures due to LTCC technology. Recently, with the rapid progress in wireless communications,to realize more highly integrated passive components in multilayer LTCC structure, however, it is important to control the matching behavior between component and substrate. The dielectric compositions the permittivity range of which is 20100 are most appropriate for realizing strip or microstrip resonator structures in LTCC multilayer structures due to the RF frequency range which is used in current telecommunication systems (130GHz) and the desirable chip sizes in the current technologies (210 mm)[.

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Periodical:

Advanced Materials Research (Volume 906)

Pages:

25-30

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.906.25

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Online since:

April 2014

Authors:

Yong Gang Zhang*, Xiao Gang Wu

Keywords:

LTCC, Middle Permittivity

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