Diffusion Bonding of Mg/Cu Alloy with Zn Interlayer Metal

Yan Bin Li; Ting Lu; Le Cao; Yun Li; Tao Zheng

doi:10.4028/www.scientific.net/AMR.911.168

Paper Titles

New Method of Phase Transformations Calculation in Metals with Structural Features of the Initial and New Phases
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Optimization of the Compositions of the High Strength Casting Aluminium Alloys Based on Nickel Eutectic
p.152

Experimental Study of Impact Strength of Al-6063 Alloy Processed by Equal Channel Angular Extrusion
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Some Aspects on Cold Deformation Characteristics of Sintered Fe-0.8%C-1%Si-0.4%Cu Steel Preforms
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Diffusion Bonding of Mg/Cu Alloy with Zn Interlayer Metal
p.168

The Influence of Fe Additives on Silica Brick Microstructure
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Prediction of Flow Stress Anisotropy and Tension Compression Asymmetry of Hot Rolled AZ31B Mg Alloy
p.178

Effect of Barium-to-Strontium on Leakage Current Mechanism of Sol-Gel Ba_xSr_1-xTiO₃ Thin Films
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Performance Investigation of Non-Linear Insulator against Surface Tracking on Wind Turbine Blade Surface
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 911Diffusion Bonding of Mg/Cu Alloy with Zn...

Diffusion Bonding of Mg/Cu Alloy with Zn Interlayer Metal

Abstract:

AZ31B Mg alloy and Cu were joined through diffusion bonding using a Zn interlayer film prepared. The element distribution, microstructure and hardness was studied by means of scanning electron microscope(SEM), Energy Dispersive Spectrdmeter (EDS) and Microhardness tester.The result show that SEM results indicate the diffusion zone of Mg/Cu diffusion bonded joint consists of intermetallic compounds. Via enhanced holding time,these intermetallic compounds go steady gradually. Thus the Mg/Cu diffusion bonded joint of strength can be improved. This work provides a theoretical reference and practical experience for Mg/Cu dissimilar metal connection.

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Periodical:

Advanced Materials Research (Volume 911)

Pages:

168-172

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.911.168

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Online since:

March 2014

Authors:

Yan Bin Li, Ting Lu, Le Cao, Yun Li, Tao Zheng

Keywords:

Diffusion Binding, Mg⁄Cu, Microstructure, Zn Interlayer

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