Effects of Annealing on Microstructure and Properties of Cu-Nb Wires

Abstract:

This paper reports the results of investigation into the effects of annealing on microstructure, hardness, and electrical resistivity of accumulated drawing and bundling (ADB) Cu-Nb wires. Noticeable change took place during annealing. When annealing was conducted at 500 °C, samples showed higher hardness and electrical resistivity in the wires with higher deformation. Furthermore, samples annealed at temperatures above 500 °C showed delay in recovery and recrystallization. At 900 °C, however, the reverse was true, with samples showing lower hardness and resistivity in wire with higher degree of deformation.

• Periodical: Advanced Materials Research (Volume 922)
• Pages: 81-85
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.922.81
• Online since: May 2014
• Authors: Li Ping Deng*, Ke Han, Ze Yuan Sun, Xiao Fang Yang, Qing Liu
• Keywords: Annealing, Cu-Nb Microcomposite Wires, Hardness, Resistivity

References

[1] A. Misra, Verdier M, Lu YC, Kung H, Mitchell TE, Nastasi M, et al, Structure and Mechanial Properties of Cu-X(X=Nb,Cr,Ni) Nanolayered Composties, Scripta Mater. 39 ( 1998) 555-60.

DOI: 10.1016/s1359-6462(98)00196-1

[2] Phillips MA, Clemens BM, Nix WD, A model for dislocation behavior during deformation of Al/Al3Sc (fcc/L12) metallic multilayers, Acta Mater. 51 (2003) 3157-70.

DOI: 10.1016/s1359-6454(03)00127-7

[3] HONG SI, HILL MA, Microstructure Stability and Mechanical Response of Cu-Ag Microcomposite Wires, Acta mater.46 (1998) 4111-22.

DOI: 10.1016/s1359-6454(98)00106-2

[4] Han K, Strength and Ductility of Nanostructured Composites with Co-Deformable Components, Materials Science Forum. 633-634 ( 2010) 383-92.

DOI: 10.4028/www.scientific.net/msf.633-634.383

[5] Han K, Lawson AC, Wood JT, Embury JD, Von Dreele RB, Richardson JW, Internal stresses in cold-deformed Cu-Ag and Cu-Nb wires, Philos Mag. 84 (2004) 2579-93.

DOI: 10.1080/14786430410001689981

[6] Sandim MJR, Sandim HRZ, Shigue CY, Filgueira M, Ghivelder L, Annealing effects on the magnetic properties of a multifilamentary Cu-Nb composite, Supercond Sci Tech. 16 (2003) 307-13.

DOI: 10.1088/0953-2048/16/3/301

[7] Sandim HRZ, Sandim MJR, Bernardi HH, Lins JFC, Raabe D, Annealing effects on the microstructure and texture of a multifilamentary Cu-Nb composite wire, Scripta Mater. 51 (2004) 1099-104.

DOI: 10.1016/j.scriptamat.2004.07.026

[8] Sandim MJR, Sandim HRZ, Bernardi HH, Shigue CY, Virgens MGd, Ghivelder L, et al, Annealing effects on the microstructure, electrical, and magnetic properties of jelly-rolled Cu-Nb composite wires, Supercond Sci Tech. 18 (2005) 35-40.

DOI: 10.1088/0953-2048/18/1/006

[9] Deng L, Yang X, Han K, Lu Y, Liang M, Liu Q, Microstructure and texture evolution of Cu–Nb composite wires, Materials Characterization. 81 (2013) 124-33.

DOI: 10.1016/j.matchar.2013.04.013

[10] Sharma G, Ramanujan RV, Tiwari GP, Instability mechanisms in lamellar microstructures, Acta Mater. 48 (2000) 875-89.

DOI: 10.1016/s1359-6454(99)00378-x

[11] Guizhong G, Effect of annealing treatment on microstructure and property of red copper, Journal of Pingyuan University. 23 (2006) 129-31.

[12] Bernardi HH, Sandim HRZ, Verlinden B, Raabe D, Heat treatment of a niobium single crystal deformed by ECAE, Germany (2007).

DOI: 10.4028/www.scientific.net/msf.558-559.125

[13] Lim SCV, Rollett AD, Length scale effects on recrystallization and texture evolution in Cu layers of a roll-bonded Cu-Nb composite, Mat Sci Eng a-Struct. 520 (2009) 189-96.

DOI: 10.1016/j.msea.2009.05.020