Application of Lift-Off Process in Fabricating Nanoimprint Stamp

Abstract:

Lift-off process is a critical combined process in semiconductor manufacturing field. However, traditional methods of lift-off process can hardly be carried out in Ultraviolet Nanoimprint Lithography due to the poor solubility of ultraviolet imprint resist. In this paper, a modified lift-off process using a multi-layer transfer method has been introduced to solve this problem. More importantly, this method could bring an improved result even if the aspect ratio of hard stamp is small. By applying this method, we succeeded in fabricating pillar photonic crystal stamp using hole pattern mother stamp and using the newly defined stamp to fabricate nanopattern sapphire substrate. Depth of the nanopattern is 250nm and the profile of the pattern is pyramid type which is very suitable for subsequent epitaxy.

• Periodical: Advanced Materials Research (Volume 924)
• Pages: 359-365
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.924.359
• Online since: April 2014
• Authors: Zhi Hao Wang, Wen Liu*, Qiang Zuo
• Keywords: Lift-Off, Multi-Layer Transfer, Nanoimprint Lithography

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