Curing Kinetics of Silicone Epoxy Resin Containing Fluorene

Abstract:

A new epoxy resin based on dichlorosilane and 9,9-bis (4-hydroxyphenyl) fluorene was synthesized to produce a highly heat-resistant network. The chemical structure was characterized with FTIR spectroscopy and 1H-NMR. 4-4′-Diaminodiphenylsulfone (DDS) was used as the curing agent. The curing kinetics of different epoxy/DDS systems were investigated using non-isothermal differential scanning calorimetry (DSC). The results showed that the values of activation energy (E) were affected by the chemical structure of epoxy resin, and BPEBF exhibited lower curing reactivity towards DDS compared to E-51.

• Periodical: Advanced Materials Research (Volume 936)
• Pages: 28-33
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.936.28
• Online since: June 2014
• Authors: Wei Xing Deng, Yuan Wei Zhong, Jie Qin, Xue Bing Huang, Jin Wen Peng*
• Keywords: 9,9-Bis(4-Hydroxyphenyl)Fluorene, Curing Kinetics, Organic Silicon-Modified Epoxy Resin

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