An Effective N, N-Diethylthiourea as Accelerator for Microvia Filling via Copper Electrodeposition

Abstract:

The effect of N, N-diethylthiourea (DET) upon the microvia filling by Cu electrodeposition was investigated by cross-sectional images using optical microscopy. The bottom-up filling of the electroplating bath was achieved with an addition of DET. The electrochemical study indicated that the polarisation on the cathode was increased with an addition of DET. The results present DET as an accelerator which is beneficial for microvias filling for high density interconnections printed circuit board.

• Periodical: Advanced Materials Research (Volume 937)
• Pages: 214-217
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.937.214
• Online since: May 2014
• Authors: Wei Wu Ma*, Yan Wang
• Keywords: Accelerator, Filling, Printed Circuit Board (PCB)

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