The Thermal Analysis and Simulation of On-Chip Temperature Control Technology in the Micro-Gyroscope

Abstract:

The thermal analysis and simulation of on-chip temperature control technology in the micro-gyroscope is researched. According to the thermal dissipation mechanism, the thermal resistance model of on-chip temperature control technology is established. The equantions of the conduction thermal resistance and the radiation thermal resistance are deduced. According to the lumped parameter model, the transient thermal response of the proof mass is derived. Theoretical analysis indicates the temperatures of the micro-heater and the proof mass are respectively 136.79°C and 59.95°C in equilibrium conditions. The Ansys simulation model of on-chip temperature control gyroscope is constructed to optimize the transient thermal response and the temperature distribution in steady-state. The simulation results show that the maximum temperature of glass thin-film is about 137.2°C, the temperature of gyroscope structure is about 58.5°C and the temperature difference is within 1°C in the steady-state. In the transient response, the temperature of gyroscope structure can be stabilized in the 12.5s. The simulation results prove that the on-chip temperature technology of micro-gyroscope has an excellent temperature uniformity and rapid temperature response.

• Periodical: Advanced Materials Research (Volume 940)
• Pages: 386-390
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.940.386
• Online since: June 2014
• Authors: Bo Yang*, Lu Xu, Wen Shu Fu, Yun Peng Deng
• Keywords: Micro-Gyroscope, On-Chip Temperature Control, Thermal Analysis, Thermal Resistance

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