Paper Titles

Effect of Tb₄O₇ Doping on Wear Resistance of High-Alumina Ceramic
p.534

Low-Temperature-Tunnel of High-Alumina Ceramics with Good Wear Resistance
p.538

Preparation of the System of MgO-CaO-SiO₂-Al₂O₃-Y₂O₃Wear-Resistant Alumina Ceramics
p.542

Study of Nonlinear Current-Voltage Characteristic of Semiconductor Ceramic by the Method of Tilted Energy Band
p.547

The Ways to the Main Problems in the Application of Low Temperature Co-Fired Ceramics Technology (LTCC)
p.551

Study on the Crystal Bonding Mechanism of Al₂O₃–ZrO₂ Ceramic Composite
p.555

Effect of Calcite Content on Firing Characteristics and its Sintering Properties of Nixing Pottery
p.560

Analysis of Pop-In Phenomenon in the Process of Ceramic Materials Instrumented Indentation
p.564

A Life Prediction Model for LEDs Lamps Based on the Thermal Life Theory
p.571

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 941-944The Ways to the Main Problems in the Application...

The Ways to the Main Problems in the Application of Low Temperature Co-Fired Ceramics Technology (LTCC)

Article Preview

Abstract:

As a new promising integrating and packing technology, the low temperature co-fired ceramic (LTCC) technology shows great potential in the microelectronics field and attracts great attentions for the scholars at home and abroad. In this paper, the practical application of LTCC is introduced and the emphasis is focused on the ways to the main problems in the application. As to this point, some advices are also given for the future development.

You might also be interested in these eBooks

Materials and Processes Technologies V

Info:

Periodical:

Advanced Materials Research (Volumes 941-944)

Pages:

551-554

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.941-944.551

Citation:

Cite this paper

Online since:

June 2014

Authors:

Xiao Dong Liu, Shao Hong Wang*, Zhao Xia Hou, Dan Zhou, Li Qiong Yang, Wei Wei Hu

Keywords:

Application, Low Temperature Co-Fired Ceramic (LTCC), Microelectronics, Problem

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2014 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] S. Young: Multilayer Ceramic Technologies, in: R.C. Buchaman (Ed. ), Marcel Dekker, New York, 1986, p.403.

[2] AIex Beiley, MD Northrop Grumman, W. Foley, et a1: IEEE MTT-S Digest Part, 2(1997), pp.999-1002.

[3] Yuehui Wang, Ji Zhou, Jianhong Shen, et a1: Journal of Inorganic Materials, 21(1997), pp.999-1002.

[4] Jianhua Shi, Zhenyu Qian: Application and Practice-Component Application. Vol. 12(2009), pp.37-39.

[5] Haiwen Liu, Wei Zheng: Microelectronic Devices and Application. Vol. 46(2009), pp.502-508.

[6] MEINEL H H: IEEE Trans2MTT. Vol. 43 (1995), pp.1639-1653.

[7] Young Chul Lee: IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, Vol. 13( 2003), pp.499-501.

[8] Jounghyun Yim, Daehyun Kang, Seokho Son, et al: Microwave and Optical Technology Letters, Vol. 49( 2007), pp.578-581.

[9] Shuaiqi Yue, Zhihui Liu, Yang Xu, et al: Electronic Components and Materials. Vol. 30(2011), pp.45-47.

[10] H Y ZHANG, PINJALA D: Appl Therm Eng, 25(2005), pp.1472-148.

[11] Y. Imanaka: New York: Springer, 2005, p.2.

[12] H. Nishikawa. Proceedings of the 1993 Japan International Electronic Manufacturing Technology Symposium, Kanazawa, 1993, pp.238-241.

[13] M. Itagaki, K. Miura, Y. Hakotani, et al. Proceedings of the 29th International Symposium on Microelectronics, Dallas, 2105(1993), pp.221-225.

[14] K. Miura. Proceedings of the 8th International Microelectronics Conference, Omiya Sonic, 1994, pp.220-224.

[15] M. Nicak, B. Psota, P Kosina, et al: Electronics Technology (ISSE), 2012 35th International Spring Seminar on. 2012, pp.128-132.

DOI: 10.1109/isse.2012.6273122

[16] Torsten Rabe, Wolfgang A. Schiller, Thomas Hochheimer, et al: International Journal of Applied Ceramic Technology. 2(2005), pp.374-382.

[17] Xuemin Cui, Ji Zhou, Yuehui Wang, et al: ELECTRONIC COMPONENTS & MATERIALS. Vol. 10(2005), pp.50-55.

[18] L.E. Khoong, Y.M. Tan and Y.C. Lam: Journal of the European Ceramic Society. Vol. 30 (2010), p.1973–(1987).

[19] D. Jurków, L. Golonka: Journal of European Ceramic Society. Vol. 32(2012), pp.2431-2441.

[20] D. J. Miehls, F. J. Martin, R. G. Pond, P. S. Fleischner, U.S. Patent No. 5, 249, 355. (1993).

[21] K. Malecha, D. Jurków, L. Golonka: Journal of Micromechanics and Microengineering. Vol. 9 (2009), p.1–10.

[22] D. Jurków, L. Golonka: Journal of European Ceramic Society. Vol. 32(2012), pp.2431-2441.