Study of Additives on Performance of Copper Films with Pulse Electroplating

Jian Jun Xi; Jun Zhao; Zhi Gang Wang; Chun Ping Zhao

doi:10.4028/www.scientific.net/AMR.955-959.56

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 955-959Study of Additives on Performance of Copper Films...

Study of Additives on Performance of Copper Films with Pulse Electroplating

Abstract:

The effects of copper deposition with three different additives were studied, which are triethanolamine, selimium dioxide and allylthiourea in citrate electrolyte. SEM (scanning electron microscopy) was used in the investigation of surface structures formed in the course of processing. The cathode polarization test was to tell the influence of different components and electroplating conditions to the plating system. Through orghogonal experiments, it was observed that the best additive combination is triethanolamine 3ml/l, selimium dioxide0.012g/l and allylthiourea0g/l.

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Periodical:

Advanced Materials Research (Volumes 955-959)

Pages:

56-61

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.955-959.56

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Online since:

June 2014

Authors:

Jian Jun Xi, Jun Zhao*, Zhi Gang Wang, Chun Ping Zhao

Keywords:

Additive, Copper, Performance, Pulse Electroplating

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