Dynamic Analysis of Optical Brittle Crystal Slicing by Using Wiresaw

Yan Bo Feng; Tao Sun

doi:10.4028/www.scientific.net/AMR.97-101.45

Paper Titles

The Crystal Structural Properties of Sputtered ZnO Films Containing Internal Stress
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The Comparison Research of Two Working Electrodes in Electrochemical Reduction of Silicon Tetrachloride
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Effect of Ca Content on Mechanical Properties of 4N Gold Wire for Quad Flat Nolead (QFN) Stacked Die Package
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Characterization of 0.5 µm BiCMOS Gate Oxide Using Time Dependent Dielectric Breakdown Test
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Dynamic Analysis of Optical Brittle Crystal Slicing by Using Wiresaw
p.45

On the Warpage in the Lower Case of Lead-Acid Batteries
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Effect of Forming Parameters on the Mechanical Properties of Thixomolding AZ91D Magnesium Alloy
p.55

Analysis on Transmission Characteristics of New Axis-Fixed Cycloid Gear
p.60

Research on the Key Technologies for New Large Dual-Platen High-Precision Clamping System
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 97-101Dynamic Analysis of Optical Brittle Crystal...

Dynamic Analysis of Optical Brittle Crystal Slicing by Using Wiresaw

Abstract:

In recent years, wire sawing is considered to be a potentially better technology of slicing brittle crystals especially semiconductor, owing to the unmatched advantages of slicing large ingot into thin wafers with high efficiency, fine quality and less kerf loss. This paper analyses the dynamic effect on wire from a variety of excitation and mechanical structure in the process of cutting on the basis of the effects of vibration on slicing wafer quality. A suitable model is built according to Hamilton principle, closed form expressions is present for the steady state response using finite element method. The relation between inherent characteristics of wiresaw and different system parameters is obtained.