The Effect of Chip’s Size on the Performence of GaN-Based LED Chips

Article Preview

Abstract:

Before cutting into a single chip, we have tested LED chips with different sizes that is produced on the some condition. With different drive currents, we compared the luminous intensity and working voltage about the two samples. The results show that: within a certain range, the larger chip is better. Because of low light utilization rate, it isn’t the bigger of chip area the better the performance is. We should choose the best size in application.

You might also be interested in these eBooks

Info:

Periodical:

Advanced Materials Research (Volumes 971-973)

Pages:

1180-1182

Citation:

Online since:

June 2014

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2014 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] LB Chang, CI Yen, TW You, etc. Improving the reliability of eutectic bonding vertical power light-emitting diodes by a Mo buffer layer [J]. Thin Solid Films, (2014).

DOI: 10.1016/j.tsf.2014.03.029

Google Scholar

[2] S Lan, CM Tan, K Wu. Methodology of reliability enhancement for high power LED driver [J]. Microelectronics Reliability, (2014).

DOI: 10.1016/j.microrel.2014.01.027

Google Scholar

[3] M. Shatalov, A. Chitnis, P. Yadav, et a1. Thermal analysis of flip-chip packaged 280 nm nitride-based deep ultraviolet light-emitting diodes [J]. Appl. Phys. Lett., Vol. 86(2005), p.201109.

DOI: 10.1063/1.1927695

Google Scholar

[4] O. B. Shchekin, J. E. Epler, T. A. Trottier, et a1. High performance thin-film flip-chip InGaN–GaN light-emitting diodes [J]. Appl. Phys. Lett., vol. 89 (2006), p.071109.

DOI: 10.1063/1.2337007

Google Scholar

[5] T. Fujii, Y. Gao, R. Sharma, et a1. Increase in the extraction efficiency of GaN-based light-emitting diodes via surface roughening [J]. Appl. Phys. Lett., vol. 84(2004), p.9.

DOI: 10.1063/1.1645992

Google Scholar

[6] Yong Tang, Xinrui Ding, Binhai Yu, etc. A high power LED device with chips directly mounted on heat pipes[J]. Applied Thermal Engineering, vol. 66 (2014), pp.632-639.

DOI: 10.1016/j.applthermaleng.2014.02.067

Google Scholar

[7] X. Perpina, R. Werkhoven, J. Jakovenko, etc. Design for reliability of solid state lighting systems . Microelectronics Reliability, vol. 52 (2012), pp.2294-2300.

DOI: 10.1016/j.microrel.2012.06.068

Google Scholar

[8] Bong-Min Song, Bongtae Han, Joon-Hyun Lee. Optimum design domain of LED-based solid state lighting considering cost, energy consumption and reliability. Microelectronics Reliability, vol. 53 (2013), pp.435-44.

DOI: 10.1016/j.microrel.2012.10.010

Google Scholar