[1]
LB Chang, CI Yen, TW You, etc. Improving the reliability of eutectic bonding vertical power light-emitting diodes by a Mo buffer layer [J]. Thin Solid Films, (2014).
DOI: 10.1016/j.tsf.2014.03.029
Google Scholar
[2]
S Lan, CM Tan, K Wu. Methodology of reliability enhancement for high power LED driver [J]. Microelectronics Reliability, (2014).
DOI: 10.1016/j.microrel.2014.01.027
Google Scholar
[3]
M. Shatalov, A. Chitnis, P. Yadav, et a1. Thermal analysis of flip-chip packaged 280 nm nitride-based deep ultraviolet light-emitting diodes [J]. Appl. Phys. Lett., Vol. 86(2005), p.201109.
DOI: 10.1063/1.1927695
Google Scholar
[4]
O. B. Shchekin, J. E. Epler, T. A. Trottier, et a1. High performance thin-film flip-chip InGaN–GaN light-emitting diodes [J]. Appl. Phys. Lett., vol. 89 (2006), p.071109.
DOI: 10.1063/1.2337007
Google Scholar
[5]
T. Fujii, Y. Gao, R. Sharma, et a1. Increase in the extraction efficiency of GaN-based light-emitting diodes via surface roughening [J]. Appl. Phys. Lett., vol. 84(2004), p.9.
DOI: 10.1063/1.1645992
Google Scholar
[6]
Yong Tang, Xinrui Ding, Binhai Yu, etc. A high power LED device with chips directly mounted on heat pipes[J]. Applied Thermal Engineering, vol. 66 (2014), pp.632-639.
DOI: 10.1016/j.applthermaleng.2014.02.067
Google Scholar
[7]
X. Perpina, R. Werkhoven, J. Jakovenko, etc. Design for reliability of solid state lighting systems . Microelectronics Reliability, vol. 52 (2012), pp.2294-2300.
DOI: 10.1016/j.microrel.2012.06.068
Google Scholar
[8]
Bong-Min Song, Bongtae Han, Joon-Hyun Lee. Optimum design domain of LED-based solid state lighting considering cost, energy consumption and reliability. Microelectronics Reliability, vol. 53 (2013), pp.435-44.
DOI: 10.1016/j.microrel.2012.10.010
Google Scholar