Analysis of Transient Thermal Stress of IGBT Module Based on Electrical-Thermal-Mechanical Coupling Model

Qing Yuan Zheng; Min You Chen; Bing Gao; Nan Jiang

doi:10.4028/www.scientific.net/AMR.986-987.823

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 986-987Analysis of Transient Thermal Stress of IGBT...

Analysis of Transient Thermal Stress of IGBT Module Based on Electrical-Thermal-Mechanical Coupling Model

Abstract:

Reliability of IGBT power module is one of the biggest concerns regarding wind power system, which generates the non-uniform distribution of temperature and thermal stress. The effects of non-uniform distribution will cause failure of IGBT module. Therefore, analysis of thermal mechanical stress distribution is crucially important for investigation of IGBT failure mechanism. This paper uses FEM method to establish an electrical-thermal mechanical coupling model of IGBT power module. Firstly, thermal stress distribution of solder layer is studied under power cycling. Then, the effects of initial failure of solder layer on the characteristic of IGBT module is investigated. Experimental results indicate that the strain energy density and inelastic strain are higher which will reduce reliability and lifetime of power modules.

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Periodical:

Advanced Materials Research (Volumes 986-987)

Pages:

823-827

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.986-987.823

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Online since:

July 2014

Authors:

Qing Yuan Zheng*, Min You Chen, Bing Gao, Nan Jiang

Keywords:

Electrical-Thermal Mechanical Coupling, IGBT, Thermal Stress

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References

[1] L. Wei, , R. J. Kerkman, R. A. Lukaszewski, H. Lu and Z. Yuan: Industry Applications, Vol. 47 (2011) No. 3, p.1794.

Google Scholar

[2] P. J. Tavner, G. J. W. Van Bussel, F. and Spinato: Power Electronics, Machines and Drives (Dublin, Ireland, April 4-6, 2006) p.127.

Google Scholar

[3] K. Shinohara and Q. Yu: Electronic Packaging Technology & High Density Packaging (Beijing, China, Aug. 10-13, 2009) p.1277.

Google Scholar

[4] T. Y. Hung, S. Y. Chiang, C. J. Huang, C. C. Lee and K. N. Chiang: Microelectronics Reliability, Vol. 51 (2011) No. 9, p.1819.

Google Scholar

[5] L. B. Zheng, L. Han, J. Liu and X. H. Wen: Transactions of China Electrotechnical Society, Vol. 26 (2011) No. 7, p.242.

Google Scholar

[6] B. A. Zahn: In Electronic Components and Technology Conference, 2002. Proceedings. 52nd (San Diego, USA, May 31, 2002) p.1475.

Google Scholar

[7] T. Anzawa, Q. Yu, T. Shibutani and M. Shiratori. In Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th (Singapore, Dec. 10-12, 2007) p.94.

DOI: 10.1109/eptc.2007.4469833

Google Scholar

[8] X. P. Xie, X. D. Bi, J. Hu and G. Y. Li. Semiconductor Technology, Vol. 34 (2009) No. 10, p.960.

Google Scholar

[9] Boettcher, Matthias, and F. W. Fuchs. In Power Electronics and Applications, Proceedings of the 2011-14th European Conference on (Birmingham, Aug. 30-Sept. 1, 2011) p.1.

Google Scholar