DSC Study of Recrystallization in Wiredrawn Industrial Copper

Abstract:

The goal of this work is to investigate the recrystallization reaction in cold wiredrawn industrial copper. We have used a differential scanning calorimetry and X-ray Diffraction techniques. The stored and apparent activation energies have been determined by differential scanning calorimetry under isochronal conditions. The differential scanning calorimetry results have been analyzed using models developed by Kissinger, Ozawa, Boswell, and Starink. In addition, the transformed fraction, as a function of temperature, and some kinetic parameters have been determined. We have found that cold wiredrawn affects some microstructure proprieties of the material, such the increase of stored and apparent activation energies, and dislocation density after deformation.

• Periodical: Advanced Materials Research (Volume 997)
• Pages: 646-650
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.997.646
• Online since: August 2014
• Authors: Lahcene Fellah*, Zakaria Boumerzoug
• Keywords: Dislocation Density, DSC, Industrial Copper, Recrystallization, Wiredrawing, X-Ray Diffraction (XRD)

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