Fabrication and Evaluation of Ag-Bi2223 Composite Tapes with Interfilamentary Resistive Barriers

Ryoji Inada; Yoshitaka Iwata; Yuichi Nakamura; Akio Oota; Ping Xiang Zhang

doi:10.4028/www.scientific.net/AST.47.137

Paper Titles

Transport Properties over Critical Currents for Ag-Sheathed Bi₂Sr₂CaCu₂O₈ Superconductors with Different E-J Dependence
p.118

Progress of YBCO Coated Conductor in JAPN and Recent Advance of PLD and IBAD Method
p.124

MgB₂ Composite Superconductors Made by Ex Situ and In Situ Process
p.131

Fabrication and Evaluation of Ag-Bi2223 Composite Tapes with Interfilamentary Resistive Barriers
p.137

Preparation and Properties of Advanced MgB₂ Wires and Tapes
p.143

Sol-Gel Ink-Jet Printing Technique for Synthesis of Buffer Layers of Coated Conductors
p.153

Fabrication of Bi₂Sr₂Ca_n-1Cu_nO_y / Al₂O₃-Particles on MgO Films by rf Magnetron Sputtering Method
p.159

Preparation of Partial-Melted Sm-Ba-Cu-O Bulk Superconductor
p.165

HomeAdvances in Science and TechnologyAdvances in Science and Technology Vol. 47Fabrication and Evaluation of Ag-Bi2223 Composite...

Fabrication and Evaluation of Ag-Bi2223 Composite Tapes with Interfilamentary Resistive Barriers

Abstract:

We fabricated Ag-sheathed Bi2223 composite tapes with interfilamentary resistive barriers by using powder-in-tube (PIT) method and evaluated their AC loss characteristics at 77 K. The mixture of Ca2CuO3 and 30 wt% Bi2212 are used as the barrier material for tape fabrication. The barrier layers were coated on all surfaces of the hexagonal monocore wires. Then, several pieces of the coated wires were stacked and inserted into an Ag tube, and the composites were deformed into tape shape. By introducing the barrier layers between the filaments, the Jc values at 77 K and self-field are degraded about 15%. The loss measurements under AC parallel transverse magnetic field were systematically performed, as a function of field amplitude and frequency. The loss properties in the barrier tape were compared with those in the tape without barriers. The results indicated that introducing Ca2CuO3 barriers is effective to suppress the electromagnetic coupling among the filaments and also to reduce the magnetization losses under parallel transverse field. We also present the fabrication of the barrier tapes on the order of several meters, together with the uniformity of superconducting properties along a length direction.

You might also be interested in these eBooks

Science and Engineering of Novel Superconductors V

View Preview

Info:

Periodical:

Advances in Science and Technology (Volume 47)

Pages:

137-142

DOI:

https://doi.org/10.4028/www.scientific.net/AST.47.137

Citation:

Cite this paper

Online since:

October 2006

Authors:

Ryoji Inada, Yoshitaka Iwata, Yuichi Nakamura, Akio Oota, Ping Xiang Zhang

Keywords:

AC Loss, Bi2223 Tapes, Filament Coupling, Resistive Barriers

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] K. Kwasnitza, St. Clerk, R. Flükiger, Y.B. Huang: Physica C 299 (1998), p.113.

Google Scholar

[2] M. Dhallé, A. Polcari, F. Marti, G. Witz, Y. B. Huang, R. Flükiger, St. Clerc, K. Kwasnitza, Physica C 310 (1998), p.127.

DOI: 10.1016/s0921-4534(98)00447-x

Google Scholar

[3] G. Witz, M. Dhallé, R. Passerini, X. -D. Su, Y.B. Huang, A. Erb, R. Flükiger: Cryogenics 41 (2001), p.97.

DOI: 10.1016/s0011-2275(01)00054-6

Google Scholar

[4] P.X. Zhang, R. Inada, Y. Takatori, A. Oota, H. Fujimoto, P. Ji, Z.Z. Duan, C.S. Li, H.L. Zheng, L. Zhou: IEEE Trans. Appl. Supercond. 11 (2001), p.2784.

DOI: 10.1109/77.919641

Google Scholar

[5] H. Maeda, T. Inaba, M. Sato, P.X. Zhang, W.P. Chen: Physica C 357-360 (2001), p.1230.

Google Scholar

[6] R. Nast, H. Eckelmann, O. Zabara, S.I. Schlachter, W. Goldacker: Physica C 372-376 (2002), p.1777.

DOI: 10.1016/s0921-4534(02)01124-3

Google Scholar

[7] N. Ayai, E. Ueno, K. Hayashi, K. Sato, K. Yasuda: Physica C 392-396 (2003), p.1003.

DOI: 10.1016/s0921-4534(03)01156-0

Google Scholar

[8] N. Ayai, K. Hayashi, K. Yasuda: IEEE Trans. Appl. Supercond 15 (2005). P. 2510.

Google Scholar

[9] P.X. Zhang, A. Oota, R. Inada, T. Uno, T. Yamamoto, Y. Takatori, K. Fukuyama, H. Fujimoto, L. Zhou: Physica C 357-360 (2001), p.1222.

DOI: 10.1016/s0921-4534(01)00497-x

Google Scholar

[10] N. Amemiya, O. Tsukamoto, M. Torii, M. Ciszek, H. Kawasaki, E. Mizushima, S. Ishii, N. Ayai, K. Hayashi, M. Ueyama: IEEE Trans. Appl. Supercond. 10 (2000), p.1204.

DOI: 10.1109/77.828450

Google Scholar

[11] J.J. Rabbers, D.C. van der Laan, B. ten Haken, H. J. ten Kate: IEEE Trans. Appl. Supercond. 9 (1999), p.1185.

DOI: 10.1109/77.783511

Google Scholar

[12] S. Yamamura, M. Sugahara, O. Tsukamoto, M. Yamaguchi, M. Yamamoto: Superconductor Engineering (in Japanese), The Institute of Electrical Engineers of Japan (1988), p.132.

Google Scholar