Embroidered Interconnections and Encapsulation for Electronics in Textiles for Wearable Electronics Applications

Abstract:

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This document explains different approaches to integrating electronics in textiles. It discusses reliability standards and tests for electronics in textiles. Encapsulation technologies are evaluated concerning their applicability in textile integrated electronics. Furthermore a specific assembly with embroidered wiring and embroidered interconnections has been developed and improved. Two different encapsulation technologies have been developed for this assembly. Standardized tests have been carried out to assess the reliability of the assembly and its encapsulations. Finally the achievements are critically discussed.

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Periodical:

Main Theme:

Edited by:

Pietro VINCENZINI and Rita PARADISO

Pages:

85-94

DOI:

10.4028/www.scientific.net/AST.60.85

Citation:

T. Linz et al., "Embroidered Interconnections and Encapsulation for Electronics in Textiles for Wearable Electronics Applications", Advances in Science and Technology, Vol. 60, pp. 85-94, 2008

Online since:

September 2008

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Price:

$35.00

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