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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vol. 156AES Study of the Mass Transport of Nickel Near Ni...

AES Study of the Mass Transport of Nickel Near Ni / Cu (111) Interface

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Grain Boundary Diffusion and Grain Boundary Segregation

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Periodical:

Defect and Diffusion Forum (Volume 156)

Pages:

129-134

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.156.129

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Online since:

February 1998

Authors:

Zs. Tôkei, Dezső L. Beke, Jean Bernardini, Andree Rolland

Keywords:

AES, Copper (Cu), Diffusion, Interface, Mass Transport, Nickel Ni

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Сopyright:

© 1998 Trans Tech Publications Ltd. All Rights Reserved

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