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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vol. 156Grain Boundary Electromigration in Thin Films:...

Grain Boundary Electromigration in Thin Films: Interface Reaction and Segregation Effects

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Grain Boundary Diffusion and Grain Boundary Segregation

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Periodical:

Defect and Diffusion Forum (Volume 156)

Pages:

147-160

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.156.147

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Online since:

February 1998

Authors:

Evgeny E. Glickman

Keywords:

Creep, Electromigration, Free Surface, Grain Boundary, Grooving, Segregation

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© 1998 Trans Tech Publications Ltd. All Rights Reserved

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