Copper Diffusion in Nickel Thin Film under Stresses in the Kinetic Regime 'B'

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Periodical:

Edited by:

B. Bokstein and N. Balandina

Pages:

181-190

DOI:

10.4028/www.scientific.net/DDF.156.181

Citation:

N. Balandina et al., "Copper Diffusion in Nickel Thin Film under Stresses in the Kinetic Regime 'B'", Defect and Diffusion Forum, Vol. 156, pp. 181-190, 1998

Online since:

February 1998

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$35.00

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