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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vol. 156Copper Diffusion in Nickel Thin Film under...

Copper Diffusion in Nickel Thin Film under Stresses in the Kinetic Regime 'B'

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Grain Boundary Diffusion and Grain Boundary Segregation

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Periodical:

Defect and Diffusion Forum (Volume 156)

Pages:

181-190

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.156.181

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Online since:

February 1998

Authors:

N. Balandina, Boris S. Bokstein, A. Ostrovsky

Keywords:

Copper (Cu), Diffusion, Grain Boundary, Nickel Ni, Secondary Ion Mass Spectroscopy (SIMS), Stress, Thin Film

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© 1998 Trans Tech Publications Ltd. All Rights Reserved

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