The phenomena of grain boundary diffusion and grain boundary segregation play major roles in determining the properties and behavior of a wide variety of materials. Even though the basic principles have been known for a long time, the field continues to yield a number of very challenging questions.

Purchase this book:

eBook

978-3-0357-0675-8

$160.00 *

Add to Cart

978-3-908450-31-3

$160.00

not available

eBook+Print

978-3-908450-31-3

$256.00 *

not available

* 1-User Access (Single User-Price). For Multi-User-Price please fill a contact form

Info:

eBook:

View eBook preview

ToC:

Table of contents

Editors:

B. Bokstein and N. Balandina

DOI:

https://doi.org/10.4028/b-pe4AjK

THEMA:

TGM

BISAC:

TEC021000

Keywords:

Activation Energy, AES, Copper (Cu), Diffusion, Electromigration, Grain Boundary, Grain Boundary Diffusion, Grain Boundary Segregation, Grain Boundary Structure, Grand Potential, Interface, Nanocrystal, Nickel Ni, Polycrystal, Segregation, Stress, Sulfur, Thin Film, Triple-Junction, Vacancy

Details:

Proceedings of the International Workshop on Grain Boundary Diffusion and Grain Boudary Segregation (DiBoS-97), held in Moscow, Russia, May 1997

Pages:

292

Year:

1998

ISBN-13 (softcover):

9783908450313

ISBN-13 (CD):

9783038599913

ISBN-13 (eBook):

9783035706758

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions