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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vol. 156Strain Induced Grain Boundary Premelting due to...

Strain Induced Grain Boundary Premelting due to Heavy Pile-Up of Screw Dislocations in Deformed Copper Bicrystals

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Grain Boundary Diffusion and Grain Boundary Segregation

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Periodical:

Defect and Diffusion Forum (Volume 156)

Pages:

175-180

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.156.175

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Online since:

February 1998

Authors:

F. Inoko, Tatsuya Okada, Takafumi Yoshikawa

Keywords:

Dynamic Recrystallization (DRX), Grain Boundary Cracking, Screw Dislocation Pile-Up, Strain Induced Grain Boundary Premelting

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© 1998 Trans Tech Publications Ltd. All Rights Reserved

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