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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vol. 156

Defect and Diffusion Forum Vol. 156

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.156

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Table of Contents

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Paper Title Page

Grain Boundary Diffusion and Oxidation Processes

Authors: Jean Philibert

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Influence of Grain Boundary Diffusion on Thin Film Reactions

Authors: Patrick Gas

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Motion of the Grain Boundary System with the Triple Junctions

Authors: Lasar S. Shvindlerman, Günter Gottstein, U. Czubayko, Vera G. Sursaeva

11

Study of Grain-Boundary Diffusion of Au in Copper within ∑5 Misorientation Range in the Context of Structure of Grain Boundaries

Authors: E. Budke, Christian Herzig, S.I. Prokofjev, Lasar S. Shvindlerman

21

Grain Boundary Diffusion in Polycrystalline Solids with an Arbitrary Grain Size

Authors: Sergiy V. Divinski

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Pseudo Type-B Diffusion Regime in Cu Grain Boundaries below 250°C

Authors: D. Gupta

43

Segregation and Grain Boundary Diffusion in Metals and Elemental Semi-Conductors

Authors: Jean Bernardini

49

Nonlinear Segregation Effects on Grain Boundary Heterodiffusion Extraction of Segregation Term from a Triple Product

Authors: Boris S. Bokstein, A. Ostrovsky

51

Solute Diffusion and Segregation in Grain Boundaries of Silver and Copper

Authors: T. Surholt, Chr. Minkwitz, Christian Herzig

59

Grain Boundary Diffusion and Stability of the Triple Junctions

Authors: A.N. Aleshin, W. Gust, Eugen Rabkin, Lasar S. Shvindlerman

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