Paper Titles

Influence of Grain Boundary Diffusion on Thin Film Reactions
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Motion of the Grain Boundary System with the Triple Junctions
p.11

Study of Grain-Boundary Diffusion of Au in Copper within ∑5 Misorientation Range in the Context of Structure of Grain Boundaries
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Grain Boundary Diffusion in Polycrystalline Solids with an Arbitrary Grain Size
p.35

Pseudo Type-B Diffusion Regime in Cu Grain Boundaries below 250°C
p.43

Segregation and Grain Boundary Diffusion in Metals and Elemental Semi-Conductors
p.49

Nonlinear Segregation Effects on Grain Boundary Heterodiffusion Extraction of Segregation Term from a Triple Product
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Solute Diffusion and Segregation in Grain Boundaries of Silver and Copper
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Grain Boundary Diffusion and Stability of the Triple Junctions
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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vol. 156Pseudo Type-B Diffusion Regime in Cu Grain...

Pseudo Type-B Diffusion Regime in Cu Grain Boundaries below 250°C

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Grain Boundary Diffusion and Grain Boundary Segregation

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Periodical:

Defect and Diffusion Forum (Volume 156)

Pages:

43-48

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.156.43

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Online since:

February 1998

Authors:

D. Gupta

Keywords:

Subgrains, Activation Energy, Grain Boundary Diffusion, Kinetic Regimes, Pseudo Type-B Kinetics

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© 1998 Trans Tech Publications Ltd. All Rights Reserved

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