Paper Titles

Pseudo Type-B Diffusion Regime in Cu Grain Boundaries below 250°C
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Segregation and Grain Boundary Diffusion in Metals and Elemental Semi-Conductors
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Nonlinear Segregation Effects on Grain Boundary Heterodiffusion Extraction of Segregation Term from a Triple Product
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Solute Diffusion and Segregation in Grain Boundaries of Silver and Copper
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Grain Boundary Diffusion and Stability of the Triple Junctions
p.75

A New Method for Grain Boundary Diffusion Coefficient Measurement
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Complex Atomic-Scale Dynamics in Grain Boundaries in Silicon
p.95

Relation Between Segregation at Interfaces, Structure and Diffusion in Germanium
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Microscopic Investigation of Surface Segregation in Random Alloys
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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vol. 156Grain Boundary Diffusion and Stability of the...

Grain Boundary Diffusion and Stability of the Triple Junctions

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Grain Boundary Diffusion and Grain Boundary Segregation

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Periodical:

Defect and Diffusion Forum (Volume 156)

Pages:

75-84

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.156.75

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Online since:

February 1998

Authors:

A.N. Aleshin, W. Gust, Eugen Rabkin, Lasar S. Shvindlerman

Keywords:

Diffusion, Grain Boundary, Migration, Segregation, Stability, Triple-Junction

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© 1998 Trans Tech Publications Ltd. All Rights Reserved

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