Motion of the Grain Boundary System with the Triple Junctions
p.11
p.11
Study of Grain-Boundary Diffusion of Au in Copper within ∑5 Misorientation Range in the Context of Structure of Grain Boundaries
p.21
p.21
Grain Boundary Diffusion in Polycrystalline Solids with an Arbitrary Grain Size
p.35
p.35
Pseudo Type-B Diffusion Regime in Cu Grain Boundaries below 250°C
p.43
p.43
Segregation and Grain Boundary Diffusion in Metals and Elemental Semi-Conductors
p.49
p.49
Nonlinear Segregation Effects on Grain Boundary Heterodiffusion Extraction of Segregation Term from a Triple Product
p.51
p.51
Solute Diffusion and Segregation in Grain Boundaries of Silver and Copper
p.59
p.59
Grain Boundary Diffusion and Stability of the Triple Junctions
p.75
p.75
A New Method for Grain Boundary Diffusion Coefficient Measurement
p.85
p.85
Segregation and Grain Boundary Diffusion in Metals and Elemental Semi-Conductors
Abstract:
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Periodical:
Defect and Diffusion Forum (Volume 156)
Pages:
49-50
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Online since:
February 1998
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© 1998 Trans Tech Publications Ltd. All Rights Reserved
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