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Grain Boundary Diffusion in Polycrystalline Solids with an Arbitrary Grain Size
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Pseudo Type-B Diffusion Regime in Cu Grain Boundaries below 250°C
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Segregation and Grain Boundary Diffusion in Metals and Elemental Semi-Conductors
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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vol. 156Motion of the Grain Boundary System with the...

Motion of the Grain Boundary System with the Triple Junctions

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Grain Boundary Diffusion and Grain Boundary Segregation

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Periodical:

Defect and Diffusion Forum (Volume 156)

Pages:

11-20

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.156.11

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Online since:

February 1998

Authors:

Lasar S. Shvindlerman, Günter Gottstein, U. Czubayko, Vera G. Sursaeva

Keywords:

Grain Boundary System, Steady State Motion, Tricrystal, Triple-Junction

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© 1998 Trans Tech Publications Ltd. All Rights Reserved

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