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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vol. 156

Defect and Diffusion Forum Vol. 156

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.156

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Table of Contents

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Paper Title Page

A New Method for Grain Boundary Diffusion Coefficient Measurement

Authors: René Le Gall, Guy Saindrenan, D. Roptin

85

Complex Atomic-Scale Dynamics in Grain Boundaries in Silicon

Authors: Sokrates T. Pantelides, A. Maiti, M.F. Chisholm, S.J. Pennycook

95

Relation Between Segregation at Interfaces, Structure and Diffusion in Germanium

Authors: A. Charaї, Andree Rolland, F. Cabané

97

Microscopic Investigation of Surface Segregation in Random Alloys

Authors: A.Yu. Lozovoi, P.A. Korzhavyi, Yu.Kh. Vekilov

107

Segregation, Phase Separation and Grain Boundary Diffusion in Thin Films

Authors: Csaba Cserháti, Dezső L. Beke, I.A. Szabó

121

AES Study of the Mass Transport of Nickel Near Ni / Cu (111) Interface

Authors: Zs. Tôkei, Dezső L. Beke, Jean Bernardini, Andree Rolland

129

Grain Boundary Segregation in the Cu-Bi System

Authors: L.S. Chang, Eugen Rabkin, Boris B. Straumal, S. Hofmann, B. Baretzky, W. Gust

135

Grain Boundary Electromigration in Thin Films: Interface Reaction and Segregation Effects

Authors: Evgeny E. Glickman

147

Grain Boundary Diffusion, Electromigration and Segregation in Cu and Cu-2wt% Sn Alloy

Authors: D. Gupta

161

The Effect of Pressure on Grain Boundary Wetting, Segregation and Diffusion

Authors: Witold Łojkowski, Eugen Rabkin, Boris B. Straumal, Lasar S. Shvindlerman, W. Gust

163

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