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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vol. 156

Defect and Diffusion Forum Vol. 156

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.156

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Table of Contents

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Paper Title Page

Strain Induced Grain Boundary Premelting due to Heavy Pile-Up of Screw Dislocations in Deformed Copper Bicrystals

Authors: F. Inoko, Tatsuya Okada, Takafumi Yoshikawa

175

Copper Diffusion in Nickel Thin Film under Stresses in the Kinetic Regime 'B'

Authors: N. Balandina, Boris S. Bokstein, A. Ostrovsky

181

Influence of Precipitates on the Grain Boundary Diffusion: A Perturbative Approach

Authors: N.S. Khader, D.E. Mekki, R.J. Tarento

191

The Manifestations of the Diffusion-Coefficient Distribution Functions of the Grain Boundaries in W and Au Polycrystals

Authors: M.I. Kurkin, S.M. Klotsman, A.N. Timofeyev, V.V. Dyakin

199

The Study of the Diffusion of ⁵⁷Co in Polycrystalline Gold at the Upper Boundary of Temperature Interval Ordinarily Used in Intercrystallite Diffusion Investigations

Authors: N.I. Timofeev, S.M. Klotsman, M.I. Kurkin, V.V. Dyakin, V.K. Rudenko

205

Low-Temperature Interdiffusion in Binary and Multilayer Thin Film System

Authors: Sergey I. Sidorenko, S.M. Voloshko, M.A. Vasiliev

215

Exact Solution of Triple Junction Diffusion Problem

Authors: V.A. Ivanov, Anatoly S. Ostrovsky, A. Petelin, S. Peteline

223

Relaxation Processes in Ultrafine-Grained Copper Processed by Severe Plastic Deformation

Authors: N.M. Amirkhanov, Rinat K. Islamgaliev

229

Growth and Healing of Voids at Grain Boundary during High Temperature Creep

Authors: V.S. Gostomelskii

235

Mechanisms of Grain Boundary Diffusion in Intermetallic Compounds

Authors: Sergiy V. Divinski, Leonid N. Larikov

243

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