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The Study of the Diffusion of ⁵⁷Co in Polycrystalline Gold at the Upper Boundary of Temperature Interval Ordinarily Used in Intercrystallite Diffusion Investigations
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Low-Temperature Interdiffusion in Binary and Multilayer Thin Film System
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Exact Solution of Triple Junction Diffusion Problem
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Relaxation Processes in Ultrafine-Grained Copper Processed by Severe Plastic Deformation
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Growth and Healing of Voids at Grain Boundary during High Temperature Creep
p.235

Mechanisms of Grain Boundary Diffusion in Intermetallic Compounds
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Grain Boundary Diffusion in Thin Films under Stress Field in Kinetic Regime 'C'
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Round Table Discussion I: Diffusion in Intermetallics
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Round Table Discussion II: Grain Boundary Wetting and Liquid Grooving
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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vol. 156Growth and Healing of Voids at Grain Boundary...

Growth and Healing of Voids at Grain Boundary during High Temperature Creep

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Grain Boundary Diffusion and Grain Boundary Segregation

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Periodical:

Defect and Diffusion Forum (Volume 156)

Pages:

235-242

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.156.235

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Online since:

February 1998

Authors:

V.S. Gostomelskii

Keywords:

Grain Boundary, Growth, Healing, Vacancy

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© 1998 Trans Tech Publications Ltd. All Rights Reserved

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