Paper Titles

The Study of the Diffusion of ⁵⁷Co in Polycrystalline Gold at the Upper Boundary of Temperature Interval Ordinarily Used in Intercrystallite Diffusion Investigations
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Low-Temperature Interdiffusion in Binary and Multilayer Thin Film System
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Exact Solution of Triple Junction Diffusion Problem
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Relaxation Processes in Ultrafine-Grained Copper Processed by Severe Plastic Deformation
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Growth and Healing of Voids at Grain Boundary during High Temperature Creep
p.235

Mechanisms of Grain Boundary Diffusion in Intermetallic Compounds
p.243

Grain Boundary Diffusion in Thin Films under Stress Field in Kinetic Regime 'C'
p.249

Round Table Discussion I: Diffusion in Intermetallics
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Round Table Discussion II: Grain Boundary Wetting and Liquid Grooving
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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vol. 156Mechanisms of Grain Boundary Diffusion in...

Mechanisms of Grain Boundary Diffusion in Intermetallic Compounds

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Grain Boundary Diffusion and Grain Boundary Segregation

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Periodical:

Defect and Diffusion Forum (Volume 156)

Pages:

243-248

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.156.243

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Online since:

February 1998

Authors:

Sergiy V. Divinski, Leonid N. Larikov

Keywords:

Anti-Structure Defect, Grain Boundary Diffusion, Intermetallic Compound (IMC), Topological Order, Vacancy

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© 1998 Trans Tech Publications Ltd. All Rights Reserved

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