Paper Titles

The Study of the Diffusion of ⁵⁷Co in Polycrystalline Gold at the Upper Boundary of Temperature Interval Ordinarily Used in Intercrystallite Diffusion Investigations
p.205

Low-Temperature Interdiffusion in Binary and Multilayer Thin Film System
p.215

Exact Solution of Triple Junction Diffusion Problem
p.223

Relaxation Processes in Ultrafine-Grained Copper Processed by Severe Plastic Deformation
p.229

Growth and Healing of Voids at Grain Boundary during High Temperature Creep
p.235

Mechanisms of Grain Boundary Diffusion in Intermetallic Compounds
p.243

Grain Boundary Diffusion in Thin Films under Stress Field in Kinetic Regime 'C'
p.249

Round Table Discussion I: Diffusion in Intermetallics
p.255

Round Table Discussion II: Grain Boundary Wetting and Liquid Grooving
p.265

HomeDefect and Diffusion ForumDefect and Diffusion Forum Vol. 156Round Table Discussion I: Diffusion in...

Round Table Discussion I: Diffusion in Intermetallics

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Grain Boundary Diffusion and Grain Boundary Segregation

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Periodical:

Defect and Diffusion Forum (Volume 156)

Pages:

255-264

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.156.255

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Online since:

February 1998

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© 1998 Trans Tech Publications Ltd. All Rights Reserved

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