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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vol. 156Grain Boundary Diffusion in Thin Films under...

Grain Boundary Diffusion in Thin Films under Stress Field in Kinetic Regime 'C'

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Periodical:

Defect and Diffusion Forum (Volume 156)

Pages:

249-254

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.156.249

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Online since:

February 1998

Authors:

A. Ostrovsky

Keywords:

Diffusion, Grain Boundary, Stress, Thin Film

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© 1998 Trans Tech Publications Ltd. All Rights Reserved

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