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The Study of the Diffusion of ⁵⁷Co in Polycrystalline Gold at the Upper Boundary of Temperature Interval Ordinarily Used in Intercrystallite Diffusion Investigations
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Exact Solution of Triple Junction Diffusion Problem
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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vol. 156Low-Temperature Interdiffusion in Binary and...

Low-Temperature Interdiffusion in Binary and Multilayer Thin Film System

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Grain Boundary Diffusion and Grain Boundary Segregation

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Periodical:

Defect and Diffusion Forum (Volume 156)

Pages:

215-222

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.156.215

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Online since:

February 1998

Authors:

Sergey I. Sidorenko, S.M. Voloshko, M.A. Vasiliev

Keywords:

Auger Electron Spectroscopy (AES), Diffusion, Interface, Thin Film

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© 1998 Trans Tech Publications Ltd. All Rights Reserved

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