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Strain Induced Grain Boundary Premelting due to Heavy Pile-Up of Screw Dislocations in Deformed Copper Bicrystals
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Copper Diffusion in Nickel Thin Film under Stresses in the Kinetic Regime 'B'
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Influence of Precipitates on the Grain Boundary Diffusion: A Perturbative Approach
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The Manifestations of the Diffusion-Coefficient Distribution Functions of the Grain Boundaries in W and Au Polycrystals
p.199

The Study of the Diffusion of ⁵⁷Co in Polycrystalline Gold at the Upper Boundary of Temperature Interval Ordinarily Used in Intercrystallite Diffusion Investigations
p.205

Low-Temperature Interdiffusion in Binary and Multilayer Thin Film System
p.215

Exact Solution of Triple Junction Diffusion Problem
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Relaxation Processes in Ultrafine-Grained Copper Processed by Severe Plastic Deformation
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Growth and Healing of Voids at Grain Boundary during High Temperature Creep
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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vol. 156The Study of the Diffusion of 57Co in...

The Study of the Diffusion of ⁵⁷Co in Polycrystalline Gold at the Upper Boundary of Temperature Interval Ordinarily Used in Intercrystallite Diffusion Investigations

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Grain Boundary Diffusion and Grain Boundary Segregation

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Periodical:

Defect and Diffusion Forum (Volume 156)

Pages:

205-214

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.156.205

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Online since:

February 1998

Authors:

N.I. Timofeev, S.M. Klotsman, M.I. Kurkin, V.V. Dyakin, V.K. Rudenko

Keywords:

Diffusion, Grain Boundary, Polycrystal

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© 1998 Trans Tech Publications Ltd. All Rights Reserved

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